Superbat RF PSMP connectors are the perfect solution for board-to-board applications requiring high power. With a minimum board spacing of 12.6 mm, the three-piece design allows maximum flexibility for high-density board spacing, and is an ideal solution for blindmate situations.
PSMP connectors are the best combination of SMPs and SMAs. They are compact, board-to-board designs capable of high-performance and high-frequency. The PSMP has the exact same PCB footprint as the SMP, allowing for easy conversion of applications for higher power handling.
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FEATURES AND BENEFITS
High Frequency operation up to 10 GHz
200 W @ 2.2GHz continuous power
12.6 mm minimum board spacing
Axial misalignment: +/- 1 mm
Snap-on coupling
APPLICATIONS
Base Stations
Radios
Filters
Amplifiers
Handheld Radio
PSMP SPECIFICATIONS
| Electrical | |
| Impedance | 50 Ω |
| Frequency range | DC to 10 GHz |
| Return loss (cable connector straight) | ≥ 32 dB @ DC to 3 GHz |
| ≥ 26 dB @ 3 GHz to 6 GHz | |
| Insertion loss | ≤ 0.03 x SQRT[f (GHz)] dB |
| Insulation resistance | ≥ 5 GΩ |
| Center contact resistance | ≤ 3 mΩ |
| Outer contact resistance | ≤ 2 mΩ |
| Test voltage | 1000 V rms |
| Working voltage | 480 V rms |
| Power handling | 200 W @ 2.2 GHz |
| Contact current | ≤ 15 A DC |
| RF leakage - Interface | ≥ 75 dB @ DC to 4 GHz |
| Intermodulation 3rd order | ≤ -160 dBc (2 x 43 dBm) |
| Environmental | |
| Temperature range | -65 °C to +165 °C |
| Thermal shock | IEC 60169-1, Sub-clause 16.4 (-65 °C to +165 °C) |
| Climatic category | IEC 60169-1, Sub-clause 18 (+165 °C, 1000 hours) |
| Vibration | IEC 60068-2-64 random |
| Shock | IEC 60068-2-27 (50g, 11 ms, half-sine) |
| Max. soldering temperature (PCB connectors) | IEC 61760-1, +260 °C for 10 sec. |
| Mechanical | |
| Mating cycles | Full detent: ≥ 100 |
| Limited detent: ≥ 100 | |
| Smooth bore, Catchers mitt: ≥ 1000 | |
| Center contact captivation | axial: ≥ 7 N |
| Engagement force | Full detent: ≤ 68 N |
| Limited detent: ≤ 45 N | |
| Smooth bore, Catchers mitt: ≤ 10 N | |
| Disengagement force | Full detent: ≥ 25 N |
| Limited detent: ≥ 15 N | |
| Smooth bore, Catchers mitt: ≥ 2.2 N | |
| Axial misalignment | ± 1 mm |
| Radial misalignment | 4° |
| Board-to-board distance (min.) | 12.6 mm (solder paste thickness not included) |